Nucleation Kinetics and Solidification Temperatures of SnAgCu Interconnections During Reflow Process
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چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IEEE Transactions on Components and Packaging Technologies
سال: 2006
ISSN: 1521-3331
DOI: 10.1109/tcapt.2006.885946